Had to take some triacs off a Ren24 (wrong ones mixed in the bag) and I've never desoldered before. Went out and got a desolder braid and went at it. The problem/question is, in the process I ended up removing a couple of the solder pads. Is all lost?
The best method to remove the TO-220 package parts from the board is to first take your solder wick and set it aside until the part is out and use for cleanup. Next get a pair of hemostats. Clamp that to to tab and turn the board upside down hanging the hemostat over the table. Apply solder and heat. Eventually the weight of the hemostat will pull the TRIAC out once the solder becomes liquid and leave the runners and through holes in tack. Now use the solder wick to clean up the holes. Learned that trick over 30yrs ago and have never damaged a board since. It works for most leaded components. If you are industrious you can even place a narrow strip of thin metal under dip packages and clamp the ends with the hemostats and pull out 16 and 20 pin dips also.
All other SMD work I prefer a hotplate. Works like a champ. Though you have only about two minutes or so to get the part on or off the board , then off the hot plate before you start to cook the board. I have very good success with 80 and 100 pin 1mm pitch BGA parts using a hot plate. Even fine pitch BGA parts can be done with a hot plate.
james